The exhaustive list of topics in Electronics Systems Packaging in which we provide Help with Homework Assignment and Help with Project is as follows:
- Electronic systems packaging:
- Semiconductors.
- Products and levels of packaging.
- Packaging aspects of handheld products.
- Semiconductor Packaging:
- Semiconductor and Process flowchart.
- Wafer fabrication, inspection and testing.
- Wafer packaging; Packaging evolution.
- Wire bonding.
- Semiconductor Packages:
- Commonly used packages and advanced packages; Materials in packages.
- Thermal mismatch in packages; Current trends in packaging.
- Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits.
- Electrical Design considerations in systems packaging:
- Resistive Parasitic.
- Capacitive and Inductive Parasitic.
- Layout guidelines and the Reflection problem.
- Interconnection.
- CAD for Printed Wiring Boards:
- Benefits from CAD; Introduction to DFM, DFR & DFT.
- Components of a CAD package and its highlights.
- Design Flow considerations; Beginning a circuit design with schematic work and component layout.
- Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability.
- Printed Wiring Board Technologies:
- CAD output files for PCB fabrication; Photo plotting and mask generation.
- Process flow-chart; Vias; PWB substrates.
- Substrates continued; Video highlights; Surface preparation.
- Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs.
- PWB etching; Resist stripping; Screen-printing technology.
- Through-hole manufacture process steps; Panel and pattern plating methods.
- Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; microvias.
- Microvia technology and Sequential build-up technology process flow for high-density interconnects.
- Conventional Vs HDI technologies; Flexible circuits.
- Surface Mount Technology:
- SMD benefits; Design issues; Introduction to soldering.
- Reflow and Wave Soldering methods to attach SMDs.
- Solders; Wetting of solders; Flux and its properties; Defects in wave soldering.
- Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures.
- SMT failure library and Tin Whiskers.
- Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys.
- Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues.
- Thermal Design considerations in systems packaging:
- Thermal Design considerations in systems packaging.
- Embedded Passives Technology:
- Embedded passives; Need for embedded passives; Design Library; Embedded resistor processes.
- Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging.